JXND ELECTRONICS CO.，LIMITED >
Industry Information
-
![新闻封面图]()
Under The Screen Fingerprints Or 3d Sensing Suppress Manufacturers Bilateral Bet 2018 New Machine Has Been SetSource：360doc Release Date：2017/12/19 Click On：3918iPhone X to give up fingerprinting Face ID gradually gaining market acceptance, so that non-Apple camp phone factory also accelerated layout, according to vendor vendors revealed that Huawei, OPPO, millet and other brand manufacturers have embraced 3D sensor technology. It is foreseeable that with the 3D sensing technology market continues to open, 2018 will launch a new machine with 3D sensor capabilities will spring up, the fingerprint recognition application under the screen may face crowding-out effect.
Details
Popular Industry Information
- 1 5G Business Is Expected To Continue To Drive South Korea Exports
- 2 Amd And Nvidia Fail By Quantity Pricing Strategy Gpu Price Rise Is Still Hard To Stop
- 3 Zikuo Shares Combined Acquisition And Holdings Purple Transport Cloud Perfect Cloud Computing Industry Chain
- 4 New All-optical Diode Can Be Used In Miniature Optical Circuits
- 5 Global Crystal: Acquisition Of The World's Lowest Price Drop 15% Of The Acquisition Time Is Extended To February 10
- 6 Stmicroelectronics Announced The Initial Revenue In The Fourth Quarter Of 2020
- 7 Intel Needs To Expand Wafer To Strengthen Dram Advantage If It Wants To Get Back To First Place
- 8 This Year's First Quarter Of The Station, 5 Nanometers, Or Still Maintains High-End
- 9 Resistance Rises Again: Tdk Capacitor Rises 3-4 Times
- 10 Toshiba's $18 Billion Chip Sale Could Not Be Completed On Time: Or Consider Ipo
- Hot Keywords：
- All Intel Samsung AMD TSMC chip Qualcomm semiconductor 5G Semiconductor Apple MediaTek NVIDIA AI high pass IC AI chip Google The Department of United hair DRAM High pass CPU MLCC Taiwan Q2 HUAWEI Foxconn Toshiba Technology Chip apple revenue electronics Microelectronics Semiconductor ICs Mobile phone Huawei Microsoft ARM NXP products microelectronics semiconductors SEMI ASIC 7Nm Samsung Electronics 7 nanometers snapdragon TM IBM
